Conductive Anodic Filament Growth (CAF)

Conductive anodic filament failure is the growth or electro-migration of copper in a printed circuit board.  This growth typically bridges two oppositely biased copper conductors.

This failure can be manifested in four main ways through:

(1) hole-to-hole,
(2) line-to-line
(3) hole-to-line, and
(4) layer-to-layer

It is getting important for lead free, halogen free and hybrid material application.
Comparing to Interconnection Stress Testing-IST is to ensure conduct (copper) Quality to avoid OPEN happened in field. CAF is to avoid SHORT happened in field .

Both of SIT & CAF are key validation method for reliable PWB.

Why UL:

Established Expertise – Years of global expertise in testing and certifying PCB products and standard development for the industry

Flexible and Cost-effective Options -For better value and faster time-to-market, customers can package their safety and performance needs for a cost-effective “one-stop” approach under UL’s Printed Circuits Boards service.

Single Point of Contact – Customers can manage all of their projects through a single source of local contact which can help ease of unnecessary coordination work.