Conductive Anodic Filament Growth (CAF)
Conductive anodic filament failure is the growth or electro-migration of copper in a printed circuit board. This growth typically bridges two oppositely biased copper conductors.
This failure can be manifested in four main ways through:
(3) hole-to-line, and
It is getting important for lead free, halogen free and hybrid material application.
Comparing to Interconnection Stress Testing-IST is to ensure conduct (copper) Quality to avoid OPEN happened in field. CAF is to avoid SHORT happened in field .
Both of SIT & CAF are key validation method for reliable PWB.
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